高精密多层印刷PCB电路板

高精密多层印制电路板：

层数：2-16层
Layer range: 2-16 Layer.

PCB完成厚度：0.8-3.2mm
Board finished thickness: 0.8-3.2mm

材料：FR-4,高TG值，无卤素
Material: FR-4,  with different High TG and Halogen Free.

PCB较大尺寸：620mmx490mm
Max. finished board size: 620mmx490mm.

PCB较小钻孔孔径：0.15mm
Min. drilled hole size: 0.15mm.

PCB较小线宽/线距：0.08/0.08mm
Min. Line width: 0.08mm, Min. Line spacing: 0.08mm.

完成表面处理：沉金，喷锡，OSP抗氧化，电金，沉银
Surface technology : Immersion Gold or HAL or OSP or Plating gold or Immersion silver

防焊层颜色：绿色，蓝色
Solder mask color: Green or Blue

孔径公差：金属化孔：±0.075mm，非金属化孔：±0.05mm
Hole tolerance: PTH: ±0.075mm NPTH: ±0.05mm

通过国际认证体系：UL, RoHS, CQC, ISO 9001, ISO 14000,TS16949
Certificate: UL, RoHS, CQC, ISO 9001, ISO 14000,TS16949.